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Alchip Collaborates With Synopsys To Address Scale Up And Out Bandwidth Constraints; Collaboration Features High-Speed SerDes, Advanced Packaging And SI/PI Expertise

BenzingaBenzinga Newsdesk

Today at the TSMC 2026 North America Open Innovation Platform® (OIP) Ecosystem Forum, Alchip Technologies presented a technical paper with Synopsys on how AI data center ASICs can overcome increasingly stringent

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  1. Globenewswire IncNa

    Alchip collaborates with Synopsys to Address Scale Up and Out Bandwidth Constraints

    Alchip Technologies and Synopsys presented a collaborative technical solution at TSMC's 2026 OIP Ecosystem Forum addressing bandwidth limitations in AI data center ASICs. Their protocol-agnostic physical design approach leverages Synopsys' 224G PHY IP and Alchip's packaging expertise to overcome die-edge congestion, signal integrity challenges, and achieve near-theoretical bandwidth density limits, with potential scalability to 448G SerDes implementations.